The ESDHDxxUC series are designed to protect voltage sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). Excellent clamping capability, this series offers a low leakage current in a miniature SOD323 package.
- Peak pulse power 300W @ 8/20μs waveform
- IEC 61000-4-2 (ESD) ±30kV(air), ±30kV(contact)
- Protects Uni-directional I/O line
- Low clamping voltage
- Low leakage current
- Meet MSL level1
- Halogen free and RoHS compliant
- Computer Interfaces Protection
- Microprocessors Protection
- Serial and Parallel Ports Protection
- Control Signal Lines Protection
- Power lines on PCB Protection
- Portable instrumentation
- Peripherals
Type Number | Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
ESDHD12UC | VRWM | reverse working voltage | 12 | V | |||
VBR | reverse breakdown voltage | IT = 1 mA | 13.3 | V | |||
Tj | junction temperature | -55 | 150 | °C | |||
VC | clamping voltage | IPP = 1 A; tp = 8/20 μs | 19 | V | |||
IPP = 15 A; tp = 8/20 μs | 35 | V | |||||
IPP | peak pulse current | 8/20μs waveform | 15 | A | |||
IR | reverse leakage current | VR = 12 V | 1 | μA | |||
Cj | Junction Capacitance | VR = 0 V; f = 1 MHz; | 150 | pF |
Type number | Package | Packing | Product status | Marking | Orderable part number | Ordering code (12NC) |
---|---|---|---|---|---|---|
ESDHD12UC | SOD323 | STANDARD MARK SMD | Volume production | Standard Marking | ESDHD12UCX | 9340 730 96115 |
Type number | Ordering code (12NC) | Orderable part number | Region | Distributor | Order sample |
---|---|---|---|---|---|
ESDHD12UC | 9340 730 96115 | ESDHD12UCX | NA | NA |
Chemical content | Orderable part number | Type number | RoHS / RHF | Leadfree conversion date | MSL | MSL LF |
---|---|---|---|---|---|---|
ESDHD12UC | ESDHD12UCX | ESDHD12UC | always Pb-free | 1 | 1 |
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.