WG30R140W1

WG30R140W1 uses advanced Fine Trench Field-stop technology IGBT with monolithic body diode in TO-247 package. This device is part of Reverse-Conducting IGBTs, which represents an optimum compromise between conduction and switching losses to maximize the efficiency for soft commutation.

Features and Benefits
  • Reverse Conducting IGBT with Monolithic Body Diode
  • Maximum Junction Temperature 175 °C
  • Low Conduction Losses
  • Positive Temperature efficient for Easy Parallel Operating
  • EMI Improved Design
Applications
  • Microwave ovens
  • Induction heating
  • Resonant converters
  • Soft switching applications
Parametric
Package
Quality, reliability & chemical content
Ordering
Type Number Symbol Parameter Conditions Min Typ Max Unit
WG30R140W1 VCE  collector-emitter voltage  Tj ≥ 25 °C     1400 V
IC  collector current  limited by Tj(max); TC = 100 °C     30 A
VCE(sat)  collector-emitter saturation voltage  VGE = 15 V; IC = 30 A; Tj = 25 °C   1.8 2.3 V
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WG30R140W1

TO247

STANDARD MARKING * HORIZONTAL, RAIL PACKVolume productionStandard MarkingWG30R140W1Q9340 740 60127
Datasheet
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WG30R140W19340 740 60127WG30R140W1QNANA

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WG30R140W1WG30R140W1QWG30R140W1Leaded  H

 

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.