The ESDUDS03BF is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and low capacitance. The ESDUDS03BF is suited for using in cellular phones, portable device, digital cameras, power supplies and many other portable applications.
- DFN1006 package
- Bidirectional ESD protection of one line
- Extremely low diode capacitance
- Extremely low clamping voltage to protect sensitive I/Os
- Extremely low inductance protection path to ground
- IEC 61000-4-2 (ESD) ±20kV(air), ±12kV(contact)
- Halogen free and RoHS compliant
- Cell Phone Handsets and Accessories
- Personal Digital Assistants
- Notebooks / Desktops / Servers
- Digital Visual Interfaces (DVI)
- Display Ports (DP)
- HDMI1.3/1.4/2.0
- USB2.0/3.0/3.1
Type Number | Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
ESDUDS03BF | IPP | peak pulse current | tp = 8/20 μs | 5 | A | ||
Tj | junction temperature | -55 | 150 | °C | |||
VRWM | reverse working voltage | 3.3 | V | ||||
VBR | reverse breakdown voltage | IT = 1 mA | 3.6 | V | |||
IR | reverse leakage current | VRWM = 5 V | 1 | μA | |||
VH | holding reverse voltage | 2 | V | ||||
VC | clamping voltage | IPP = 5 A; tp = 8/20 μs | 10 | V | |||
Cj | Junction Capacitance | VR = 0 V; f = 1 MHz | 0.4 | pF |
Type number | Package | Packing | Product status | Marking | Orderable part number | Ordering code (12NC) |
---|---|---|---|---|---|---|
ESDUDS03BF | DFN1006 | STANDARD MARK SMD | Volume production | Standard Marking | ESDUDS03BFX | 9340 737 28115 |
Type number | Ordering code (12NC) | Orderable part number | Region | Distributor | Order sample |
---|---|---|---|---|---|
ESDUDS03BF | 9340 737 28115 | ESDUDS03BFX | NA | NA |
Chemical content | Orderable part number | Type number | RoHS / RHF | Leadfree conversion date | MSL | MSL LF |
---|---|---|---|---|---|---|
ESDUDS03BF | ESDUDS03BFX | ESDUDS03BF | always Pb-free |
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.