WG25R135W1 uses advanced Fine Trench Field-stop technology IGBT with monolithic body diode in TO-247 package. This device is part of Reverse-Conducting of IGBTs, which represents an optimum compromise between conduction and switching losses to maximize the efficiency for soft commutation.
- Reverse Conducting IGBT with Monolithic Body Diode
- Maximum Junction Temperature 175 °C
- Low Conduction Losses
- Positive Temperature efficient for Easy Parallel Operating
- EMI Improved Design
- Microwave ovens
- Induction heating
- Resonant converters
- Soft switching applications
Type Number | Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
WG25R135W1 | VCE | collector-emitter voltage | Tj ≥ 25 °C | 1350 | V | ||
IC | collector current | limited by Tj(max); TC = 100 °C | 25 | A | |||
VCE(sat) | collector-emitter saturation voltage | VGE = 15 V; IC = 25 A; Tj = 25 °C | 1.85 | 2.40 | V |
Type number | Package | Packing | Product status | Marking | Orderable part number | Ordering code (12NC) |
---|---|---|---|---|---|---|
WG25R135W1 | TO247 | STANDARD MARKING * HORIZONTAL, RAIL PACK | Volume production | Standard Marking | WG25R135W1Q | 9340 742 69127 |
Type number | Ordering code (12NC) | Orderable part number | Region | Distributor | Order sample |
---|---|---|---|---|---|
WG25R135W1 | 9340 742 69127 | WG25R135W1Q | NA | NA |
Chemical content | Orderable part number | Type number | RoHS / RHF | Leadfree conversion date | MSL | MSL LF |
---|---|---|---|---|---|---|
WG25R135W1 | WG25R135W1Q | WG25R135W1 |
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.