WNSC2M20065TB

WeEn Gen-2 Silicon Carbide MOSFET in a TSPAK plastic package, featured with top side cooling structure, designed for high frequency, high efficiency systems.

Features and Benefits
  • Top side cooling structure
  • Kelvin source configuration
  • Low specific on-resistance
  • Optimized dynamic performance
  • Robust gate design
  • 0V turn-off VGS for simple gate driving
  • 100% UIS Tested
  • Easy to parallel
  • RoHS compliant
Applications
  • PC/server/telecom power supplies
  • UPS & Energy storage system
  • Battery formation instrument
  • PV MPPT and inverters
  • EV Charger
  • Motor Drives
Parametric
Package
Quality, reliability & chemical content
Ordering
Type Number Symbol Parameter Conditions Min Typ Max Unit
WNSC2M20065TB VDS  drain-source voltage  25 °C ≤ Tj ≤ 175 °C     650 V
ID  drain current  VGS = 18 V; Tmb = 25 °C     151 A
Ptot  total power dissipation  Tmb = 25 °C; Tj = 175 °C     577 W
Tj  junction temperature   -55   175 °C
RDS(on)  drain-source on-state resistance  VGS = 15 V; ID = 55 A; Tj = 25 °C   20 26 
 VGS = 18 V; ID = 55 A; Tj = 25 °C   16 21
QG(tot)  total gate charge  ID = 55 A; VDS = 400 V; VGS = -4 V/18 V; Tj = 25 °C   191   nC
QGD  gate-drain charge   28   nC
Qr  recovered charge  ISD = 55 A; di/dt = 500 A/μs; VDS = 400 V; Tj = 25 °C   215   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WNSC2M20065TB

TSPAK

REEL 13\" Q1/T1 *STANDARD MARK SMD"Volume productionStandard MarkingWNSC2M20065TB6J9340 739 81118
Datasheet
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WNSC2M20065TB9340 739 81118WNSC2M20065TB6JNANA

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WNSC2M20065TBWNSC2M20065TB6JWNSC2M20065TBLeaded  H

 

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.