WMSC016F12B2S

WeEnPACK-B2 module with WeEn 1200V Gen2 SiC MOSFET and Solderpin type. Integrated with NTC temperature sensor.

Features and Benefits
  • H Bridge topology
  • Solder pin type
  • Low RDSon
  • Low Switching Losses
  • Low Qg and Crss
  • Low Inductive Design
Applications
  • Power inverters
  • AC-DC converters
  • Active power factor correctors
  • Motor drivers

 

Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ Max Unit
WMSC016F12B2S VDS  drain-source voltage       1200 V
ID  drain current  VGS = 18 V; Th = 25 °C     75 A
Ptot  total power dissipation  Th = 25 °C     114 W
Tj  junction temperature   -40   150 °C
RDS(on)  drain-source on-state  resistance  VGS = 15 V; ID = 75 A; Tj = 25 °C   16   mΩ
QG(tot)  total gate charge  ID = 50 A; VDS = 800 V; VGS = -4 V/18 V;
 Tj = 25 °C		   300   nC
QGD  gate-drain charge   50.6   nC
Qr  recovered charge  ISD = 80 A; VGS = -4 V; di/dt = 6000 A/μs;
 VR = 600 V; Tj = 25 °C		   828   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WMSC016F12B2S

WeEnPACK-B2

 TRAY PACK,EPE OR BLISTER Volume production Standard Marking WMSC016F12B2S6T 9340 738 18300
Datasheet
Chemical Content
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WMSC016F12B2S 9340 738 18300 WMSC016F12B2S6T NA NA  

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WMSC016F12B2S WMSC016F12B2S6T WMSC016F12B2S Leaded  E      

 

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.